The use of SEM to study the structure and adhesive properties of silver-containing paste sintered layers
- 作者: Gorbunov D.S., Nishchev K.N., Novopoltsev M.I., Mishkin V.P.
- 期: 卷 3, 编号 23 (2015)
- 栏目: Статьи
- ##submission.dateSubmitted##: 11.05.2025
- ##submission.dateAccepted##: 11.05.2025
- URL: https://ogarev-online.ru/2311-2468/article/view/291242
- ID: 291242
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The article presents the results of a study of the microstructure and adhesive properties of silver paste sintered layers (SP) used in power semiconductor devices for low- temperature electrically active silicon structure (CS) containing pn-junctions with molybdenum temperature compensator (MT). The microstructure of the boundaries between the sintered layer and the metallized surfaces of the COP and the MT as well as the border between the sintered layer and the surface of mechanically peel test strip was investigated by analyzing the SEM images obtained by SEM Quanta 200i 3D FEI.
作者简介
D. Gorbunov
编辑信件的主要联系方式.
Email: ogarevonline@yandex.ru
俄罗斯联邦
K. Nishchev
Email: ogarevonline@yandex.ru
俄罗斯联邦
M. Novopoltsev
Email: ogarevonline@yandex.ru
俄罗斯联邦
V. Mishkin
Email: ogarevonline@yandex.ru
俄罗斯联邦
参考
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- Schwarzbauer H., Kuhnert R. Novel Large Area Joining Technique for Improved Power Device Performance // IEEE Trans. Ind. Appl. – 1991. – Vol. 27. – No. 1. – P. 93.
- Scheuermann U., Wiedl P. Low Temperature Joining Technology – a High Reliability Alternative to Solder Contacts // Workshop on Metal Ceramic Composites for Functional Applications. – Wien, 1997. – pp. 181–192.
- Mertens C. Die Niedertemperatur-Verbindungstechnik der Leistungselektronik // Fortschrittberichte: VDI-Verlag, Düsseldorf, 2004. – 141 s.
- Нищев К. Н. Исследования свойств многослойной металлизации структур «кремний на молибдене», полученной методом магнетронного распыления // Известия высших учебных заведений. Поволжский регион. Физико-математические науки. – 2013. – № 3. – С. 248–260.
- DIN 53287-2006 Testing of adhesives for metals and adhesively bonded metal joints - Determination of the resistance to liquids.
- DIN 53282-1979 Testing of adhesives for metals and adhesively bonded metal joints; T-peel test.
- Нищев К. Н. Исследование низкотемпературного спекания серебросодержащих паст методом растровой электронной микроскопии // Прикладная физика – 2015. – № 3. – С. 10–14.
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