Email this article The use of SEM to study the structure and adhesive properties of silver-containing paste sintered layers
- Authors: Gorbunov D.S., Nishchev K.N., Novopoltsev M.I., Mishkin V.P.
- Issue: Vol 3, No 23 (2015)
- Section: Статьи
- Submitted: 11.05.2025
- Accepted: 11.05.2025
- URL: https://ogarev-online.ru/2311-2468/article/view/291242
- ID: 291242
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Abstract
The article presents the results of a study of the microstructure and adhesive properties of silver paste sintered layers (SP) used in power semiconductor devices for low- temperature electrically active silicon structure (CS) containing pn-junctions with molybdenum temperature compensator (MT). The microstructure of the boundaries between the sintered layer and the metallized surfaces of the COP and the MT as well as the border between the sintered layer and the surface of mechanically peel test strip was investigated by analyzing the SEM images obtained by SEM Quanta 200i 3D FEI.
About the authors
D. S. Gorbunov
Author for correspondence.
Email: ogarevonline@yandex.ru
Russian Federation
K. N. Nishchev
Email: ogarevonline@yandex.ru
Russian Federation
M. I. Novopoltsev
Email: ogarevonline@yandex.ru
Russian Federation
V. P. Mishkin
Email: ogarevonline@yandex.ru
Russian Federation
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