On a two-layer Si3N4/SiO2 dielectric mask for low-resistance ohmic contacts to AlGaN/GaN HEMTs


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The fabrication of a two-layer Si3N4/SiO2 dielectric mask and features of its application in the technology of non-fired epitaxially grown ohmic contacts for high-power HEMTs on AlGaN/GaN heterostructures are described. The proposed Si3N4/SiO2 mask allows the selective epitaxial growth of heavily doped ohmic contacts by nitride molecular-beam epitaxy and the fabrication of non-fired ohmic contacts with a resistance of 0.15–0.2 Ω mm and a smooth surface and edge morphology.

作者简介

S. Arutyunyan

Institute of Ultrahigh Frequency Semiconductor Electronics; Institute of Microelectronics Technology and High-Purity Materials

编辑信件的主要联系方式.
Email: spartakmain@gmail.com
俄罗斯联邦, Moscow, 117105; Institutskaya ul. 6, Chernogolovka, Moscow oblast, 142432

A. Pavlov

Institute of Ultrahigh Frequency Semiconductor Electronics

Email: spartakmain@gmail.com
俄罗斯联邦, Moscow, 117105

B. Pavlov

Institute of Ultrahigh Frequency Semiconductor Electronics

Email: spartakmain@gmail.com
俄罗斯联邦, Moscow, 117105

K. Tomosh

Institute of Ultrahigh Frequency Semiconductor Electronics

Email: spartakmain@gmail.com
俄罗斯联邦, Moscow, 117105

Yu. Fedorov

Institute of Ultrahigh Frequency Semiconductor Electronics

Email: spartakmain@gmail.com
俄罗斯联邦, Moscow, 117105

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