Epitaxial growth of GaN/AlN/InAlN heterostructures for HEMTs in horizontal MOCVD reactors with different designs
- Autores: Tsatsulnikov A.F.1,2, Lundin W.V.1,2, Sakharov A.V.1,2, Zavarin E.E.1,2, Usov S.O.1,2, Nikolaev A.E.1,2, Yagovkina M.A.1, Ustinov V.M.1,2, Cherkashin N.A.3
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Afiliações:
- Ioffe Physical–Technical Institute
- Submicron Heterostructures for Microelectronics, Research and Engineering Center
- CEMES–CNRS—Université de Toulouse
- Edição: Volume 50, Nº 9 (2016)
- Páginas: 1241-1247
- Seção: Fabrication, Treatment, and Testing of Materials and Structures
- URL: https://ogarev-online.ru/1063-7826/article/view/197932
- DOI: https://doi.org/10.1134/S1063782616090232
- ID: 197932
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Resumo
The epitaxial growth of InAlN layers and GaN/AlN/InAlN heterostructures for HEMTs in growth systems with horizontal reactors of the sizes 1 × 2", 3 × 2", and 6 × 2" is investigated. Studies of the structural properties of the grown InAlN layers and electrophysical parameters of the GaN/AlN/InAlN heterostructures show that the optimal quality of epitaxial growth is attained upon a compromise between the growth conditions for InGaN and AlGaN. A comparison of the epitaxial growth in different reactors shows that optimal conditions are realized in small-scale reactors which make possible the suppression of parasitic reactions in the gas phase. In addition, the size of the reactor should be sufficient to provide highly homogeneous heterostructure parameters over area for the subsequent fabrication of devices. The optimal compositions and thicknesses of the InAlN layer for attaining the highest conductance in GaN/AlN/InAlN transistor heterostructures.
Sobre autores
A. Tsatsulnikov
Ioffe Physical–Technical Institute; Submicron Heterostructures for Microelectronics, Research and Engineering Center
Autor responsável pela correspondência
Email: andrew@beam.ioffe.ru
Rússia, St. Petersburg, 194021; St. Petersburg, 194021
W. Lundin
Ioffe Physical–Technical Institute; Submicron Heterostructures for Microelectronics, Research and Engineering Center
Email: andrew@beam.ioffe.ru
Rússia, St. Petersburg, 194021; St. Petersburg, 194021
A. Sakharov
Ioffe Physical–Technical Institute; Submicron Heterostructures for Microelectronics, Research and Engineering Center
Email: andrew@beam.ioffe.ru
Rússia, St. Petersburg, 194021; St. Petersburg, 194021
E. Zavarin
Ioffe Physical–Technical Institute; Submicron Heterostructures for Microelectronics, Research and Engineering Center
Email: andrew@beam.ioffe.ru
Rússia, St. Petersburg, 194021; St. Petersburg, 194021
S. Usov
Ioffe Physical–Technical Institute; Submicron Heterostructures for Microelectronics, Research and Engineering Center
Email: andrew@beam.ioffe.ru
Rússia, St. Petersburg, 194021; St. Petersburg, 194021
A. Nikolaev
Ioffe Physical–Technical Institute; Submicron Heterostructures for Microelectronics, Research and Engineering Center
Email: andrew@beam.ioffe.ru
Rússia, St. Petersburg, 194021; St. Petersburg, 194021
M. Yagovkina
Ioffe Physical–Technical Institute
Email: andrew@beam.ioffe.ru
Rússia, St. Petersburg, 194021
V. Ustinov
Ioffe Physical–Technical Institute; Submicron Heterostructures for Microelectronics, Research and Engineering Center
Email: andrew@beam.ioffe.ru
Rússia, St. Petersburg, 194021; St. Petersburg, 194021
N. Cherkashin
CEMES–CNRS—Université de Toulouse
Email: andrew@beam.ioffe.ru
França, Toulouse
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