Analytical Model for Atomic-Layer Deposition of Thin Films on the Walls of Cylindrical Holes with a Relatively High Aspect Ratio
- Autores: Fadeev A.V.1, Rudenko K.V.1
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Afiliações:
- Physicotechnological Institute
- Edição: Volume 63, Nº 8 (2018)
- Páginas: 1228-1235
- Seção: Physical Electronics
- URL: https://ogarev-online.ru/1063-7842/article/view/201875
- DOI: https://doi.org/10.1134/S1063784218080054
- ID: 201875
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Resumo
A theoretical model that predicts the thickness of a film grown on the walls of high-aspect-ratio cylindrical hole using the atomic-layer deposition is proposed. The model can be used to calculate the critical time of precursor supply needed for conformal coating of the walls. An analytical model is derived to estimate the minimum time of precursor supply versus parameters of the technological process.
Sobre autores
A. Fadeev
Physicotechnological Institute
Autor responsável pela correspondência
Email: AlexVFadeev@gmail.com
Rússia, Moscow, 117218
K. Rudenko
Physicotechnological Institute
Email: AlexVFadeev@gmail.com
Rússia, Moscow, 117218
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