Analytical Model for Atomic-Layer Deposition of Thin Films on the Walls of Cylindrical Holes with a Relatively High Aspect Ratio


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Resumo

A theoretical model that predicts the thickness of a film grown on the walls of high-aspect-ratio cylindrical hole using the atomic-layer deposition is proposed. The model can be used to calculate the critical time of precursor supply needed for conformal coating of the walls. An analytical model is derived to estimate the minimum time of precursor supply versus parameters of the technological process.

Sobre autores

A. Fadeev

Physicotechnological Institute

Autor responsável pela correspondência
Email: AlexVFadeev@gmail.com
Rússia, Moscow, 117218

K. Rudenko

Physicotechnological Institute

Email: AlexVFadeev@gmail.com
Rússia, Moscow, 117218

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