Analytical Model for Atomic-Layer Deposition of Thin Films on the Walls of Cylindrical Holes with a Relatively High Aspect Ratio
- Authors: Fadeev A.V.1, Rudenko K.V.1
-
Affiliations:
- Physicotechnological Institute
- Issue: Vol 63, No 8 (2018)
- Pages: 1228-1235
- Section: Physical Electronics
- URL: https://ogarev-online.ru/1063-7842/article/view/201875
- DOI: https://doi.org/10.1134/S1063784218080054
- ID: 201875
Cite item
Abstract
A theoretical model that predicts the thickness of a film grown on the walls of high-aspect-ratio cylindrical hole using the atomic-layer deposition is proposed. The model can be used to calculate the critical time of precursor supply needed for conformal coating of the walls. An analytical model is derived to estimate the minimum time of precursor supply versus parameters of the technological process.
About the authors
A. V. Fadeev
Physicotechnological Institute
Author for correspondence.
Email: AlexVFadeev@gmail.com
Russian Federation, Moscow, 117218
K. V. Rudenko
Physicotechnological Institute
Email: AlexVFadeev@gmail.com
Russian Federation, Moscow, 117218
Supplementary files
