Microstructuring of the Surface of High-Resistivity Single-Crystalline Silicon by Chemical Etching


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The influence of various etching processes on the single-crystalline (100) silicon surface is studied. It is demonstrated that microstructuring of the surface of high-resistivity single-crystalline silicon in alkaline solutions is better performed using electrolytic methods at temperatures no lower than 80°C. Etch patterns with better-defined side faces are formed by anisotropic etching with the addition of hydrogen peroxide.

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A. Kashuba

AO NPO Orion

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Email: orion_kashuba@mail.ru
俄罗斯联邦, Moscow, 111538

E. Permikina

AO NPO Orion

Email: orion_kashuba@mail.ru
俄罗斯联邦, Moscow, 111538

S. Golovin

AO NPO Orion

Email: orion_kashuba@mail.ru
俄罗斯联邦, Moscow, 111538

M. Lakmanova

AO NPO Orion

Email: orion_kashuba@mail.ru
俄罗斯联邦, Moscow, 111538

A. Pogozheva

AO NPO Orion

Email: orion_kashuba@mail.ru
俄罗斯联邦, Moscow, 111538

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