Diffusion of interstitial magnesium in dislocation-free silicon


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Аннотация

The diffusion of magnesium impurity in the temperature range T = 600–800°C in dislocation-free single-crystal silicon wafers of p-type conductivity is studied. The surface layer of the wafer doped with magnesium by the ion implantation technique serves as the diffusion source. Implantation is carried out at an ion energy of 150 keV at doses of 5 × 1014 and 2 × 1015 cm–2. The diffusion coefficient of interstitial magnesium donor centers (Di) is determined by measuring the depth of the p–n junction, which is formed in the sample due to annealing during the time t at a given T. As a result of the study, the dependence Di(T) is found for the first time. The data show that the diffusion process occurs mainly by the interstitial mechanism.

Авторлар туралы

V. Shuman

Ioffe Physical–Technical Institute

Хат алмасуға жауапты Автор.
Email: Shuman@mail.ioffe.ru
Ресей, St. Petersburg, 194021

A. Lavrent’ev

Ioffe Physical–Technical Institute

Email: Shuman@mail.ioffe.ru
Ресей, St. Petersburg, 194021

Yu. Astrov

Ioffe Physical–Technical Institute

Email: Shuman@mail.ioffe.ru
Ресей, St. Petersburg, 194021

A. Lodygin

Ioffe Physical–Technical Institute

Email: Shuman@mail.ioffe.ru
Ресей, St. Petersburg, 194021

L. Portsel

Ioffe Physical–Technical Institute

Email: Shuman@mail.ioffe.ru
Ресей, St. Petersburg, 194021

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