Model for Thermal Oxidation of Silicon
- Авторлар: Fadeev A.V.1, Devyatko Y.N.2
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Мекемелер:
- Valiev Institute of Physics and Technology, Russian Academy of Sciences
- National Research Nuclear University MEPhI (Moscow Engineering Physics Institute)
- Шығарылым: Том 64, № 4 (2019)
- Беттер: 575-581
- Бөлім: Physical Electronics
- URL: https://ogarev-online.ru/1063-7842/article/view/203335
- DOI: https://doi.org/10.1134/S1063784219040108
- ID: 203335
Дәйексөз келтіру
Аннотация
Nanometer-thick silicon oxide films are needed for miniaturization and increase in the working rate of electronic devices. Interpretation of the initial stages of silicon oxidation is necessary for fabrication of such structures. A theoretical model of the thermal oxidation of thin silicon monolayers that takes into account an increase in the stress in the transition (oxide–substrate) layer due to oxygen accumulation therein is proposed.
Авторлар туралы
A. Fadeev
Valiev Institute of Physics and Technology, Russian Academy of Sciences
Хат алмасуға жауапты Автор.
Email: AlexVFadeev@gmail.com
Ресей, Moscow, 117218
Yu. Devyatko
National Research Nuclear University MEPhI (Moscow Engineering Physics Institute)
Хат алмасуға жауапты Автор.
Email: ydevyatko@mail.ru
Ресей, Moscow, 115409
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