Structure of aluminum films for creating tunnel junctions.

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A series of studies of the structure of aluminum films deposited on single-crystal
silicon substrates in different temperature conditions. The roughness and grain size of films of nuclei 20 nm thick, deposited at elevated temperatures, and also dusted on top of the seed layer at room temperature to a thickness of 150 nm. The film profile was measured in an electron microscope. It was found that films on the hot sublayer turn out to be smoother, more rigid (less loose) and allow one to expect the creation of superconductor–insulator–superconductor and superconductor–insulator–normal metal transitions, respectively, with a higher current density and lower capacitance.

Sobre autores

M. Strelkov

Kotelnikov Institute of Radioengineering and Electronics, Russian Academy of Sciences; Moscow Institute of Physics and Technology (National Research University)

Email: strelkov.mv@phystech.edu
Moscow, 125009 Russia; Dolgoprudnyi, Moscow oblast, 141701 Russia

A. Chekushkin

Kotelnikov Institute of Radioengineering and Electronics, Russian Academy of Sciences

Email: strelkov.mv@phystech.edu
Moscow, 125009 Russia

A. Lomov

Valiev Institute of Physics and Technology Russian Academy of Sciences

Email: strelkov.mv@phystech.edu
Moscow, 117218 Russia

S. Kraevsky

Scientific-Research Institute of Biomedical Chemistry named after V.N. Orekhovich

Email: strelkov.mv@phystech.edu
Moscow, 119121, Russia

M. Fominskii

Kotelnikov Institute of Radioengineering and Electronics, Russian Academy of Sciences

Email: strelkov.mv@phystech.edu
Moscow, 125009 Russia

M. Tarasov

Kotelnikov Institute of Radioengineering and Electronics, Russian Academy of Sciences

Autor responsável pela correspondência
Email: strelkov.mv@phystech.edu
Moscow, 125009 Russia

Bibliografia

  1. Rodionov I., Baburin A., Gabidullin A., et al. // Sci. Rep. 2019. V. 9. Article No. 12232.
  2. Greibe T., Stenberg M., Wilson C. et al. // Phys. Rev. Lett. 2011. V. 106. № 9. Article No. 097001.

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Declaração de direitos autorais © М.В. Стрелков, А.М. Чекушкин, А.А. Ломов, С.В. Краевский, М.Ю. Фоминский, М.А. Тарасов, 2023

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