Single Camera 3D Digital Image Correlation Using a Polarized System


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Resumo

In this paper, a novel single camera three dimensional digital image correlation (3D-DIC) system, using a polarized pseudo-stereo system, is proposed. Compared to traditional 3D-DIC systems using stereovision, it has a more compact structure and better vibration resistance. Compared to the conventional single camera pseudo-stereo system that splits the CCD sensor into two halves to capture the stereo views, the proposed system achieves both views using the entire CCD chip without reduction of the spatial resolution. In addition, the center of the two views stands in the center of the CCD chip, similarly to conventional 3D-DIC systems, thus minimizing the image distortion compared to the conventional pseudo-stereo system. The two overlapped views in the CCD sensor are separated using the different polarization states, and the standard 3D-DIC algorithm can be utilized directly to perform the evaluation. The principal and experimental setup are described in detail, and multiple tests are performed to validate the system.

Sobre autores

Junrui Li

Department of Mechanical Engineering, School of Engineering and Computer Science

Email: yang2@oakland.edu
Estados Unidos da América, Rochester

Boyang Zhang

Department of Mechanical Engineering, School of Engineering and Computer Science

Email: yang2@oakland.edu
Estados Unidos da América, Rochester

Xin Kang

Department of Mechanical Engineering, School of Engineering and Computer Science; Department of Mechanical Engineering, School of Mechanical and Electrical Engineering

Email: yang2@oakland.edu
Estados Unidos da América, Rochester; Putian

Wan Xu

Department of Mechanical Engineering, School of Engineering and Computer Science

Email: yang2@oakland.edu
Estados Unidos da América, Rochester

Guobiao Yang

Department of Mechanical Engineering, School of Engineering and Computer Science

Email: yang2@oakland.edu
Estados Unidos da América, Rochester

Lianxiang Yang

Department of Mechanical Engineering, School of Engineering and Computer Science

Autor responsável pela correspondência
Email: yang2@oakland.edu
Estados Unidos da América, Rochester

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