Study of the Thermal Resistance of Rough-Surfaced Junctions by Computer-Based Simulation
- 作者: Rachishkin A.A.1, Sutyagin O.V.1, Bolotov A.N.1, Izmailov V.V.1
-
隶属关系:
- Tver State Technical University
- 期: 卷 40, 编号 1 (2019)
- 页面: 58-64
- 栏目: Article
- URL: https://ogarev-online.ru/1068-3666/article/view/229252
- DOI: https://doi.org/10.3103/S1068366619010161
- ID: 229252
如何引用文章
详细
A software program has been developed that allows prediction by computer-based simulation of the thermal resistance of the contact between rough surfaces including those furnished with functional coatings. The proposed model was validated by comparing the results of numerical simulation with calculated and experimental data. The results can be used to design thermally stressed rough-surfaced junctions.
作者简介
A. Rachishkin
Tver State Technical University
编辑信件的主要联系方式.
Email: RachishkinAndr@yandex.ru
俄罗斯联邦, Tver, 170026
O. Sutyagin
Tver State Technical University
Email: RachishkinAndr@yandex.ru
俄罗斯联邦, Tver, 170026
A. Bolotov
Tver State Technical University
Email: RachishkinAndr@yandex.ru
俄罗斯联邦, Tver, 170026
V. Izmailov
Tver State Technical University
Email: RachishkinAndr@yandex.ru
俄罗斯联邦, Tver, 170026
补充文件
