Atomic Force Microscopy Measurement of the Resistivity of Semiconductors


Cite item

Full Text

Open Access Open Access
Restricted Access Access granted
Restricted Access Subscription Access

Abstract

The surface of silicon substrates has been studied experimentally and theoretically by the method of atomic force microscopy spreading resistance imaging, and measuring techniques for the spreading resistance of semiconductors have been developed based on these data. It has been shown that the resistivity of silicon can be determined reliably if the force with which the probe is pressed against the substrate exceeds some threshold. The influence of the environment on the values of currents in the probe–substrate system has been studied. It has been found that the electrical performance of semiconductors can be properly determined by atomic force microscopy spreading resistance imaging under high-vacuum conditions.

About the authors

V. A. Smirnov

Institute of Nanotechnologies, Electronics, and Equipment Engineering

Author for correspondence.
Email: vasmirnov@sfedu.ru
Russian Federation, Taganrog, 347922

R. V. Tominov

Institute of Nanotechnologies, Electronics, and Equipment Engineering

Email: vasmirnov@sfedu.ru
Russian Federation, Taganrog, 347922

N. I. Alyab’eva

University of Paris-Sud

Email: vasmirnov@sfedu.ru
France, Orsay Cedex

M. V. Il’ina

Institute of Nanotechnologies, Electronics, and Equipment Engineering

Email: vasmirnov@sfedu.ru
Russian Federation, Taganrog, 347922

V. V. Polyakova

Institute of Nanotechnologies, Electronics, and Equipment Engineering

Email: vasmirnov@sfedu.ru
Russian Federation, Taganrog, 347922

Al. V. Bykov

Institute of Nanotechnologies, Electronics, and Equipment Engineering

Email: vasmirnov@sfedu.ru
Russian Federation, Taganrog, 347922

O. A. Ageev

Institute of Nanotechnologies, Electronics, and Equipment Engineering

Email: vasmirnov@sfedu.ru
Russian Federation, Taganrog, 347922

Supplementary files

Supplementary Files
Action
1. JATS XML

Copyright (c) 2018 Pleiades Publishing, Ltd.