On additional aging-induced hardening of textured ribbon substrates prepared from binary copper-based alloys

Yu. V. Khlebnikova; D. P. Rodionov; I. V. Gervas’eva; L. Yu. Egorova; T. R. Suaridze

doi:10.1134/S1063784216020146

On additional aging-induced hardening of textured ribbon substrates prepared from binary copper-based alloys

Authors: Khlebnikova Y.V.¹, Rodionov D.P.¹, Gervas’eva I.V.¹, Egorova L.Y.¹, Suaridze T.R.¹
Affiliations:
1. Institute of Metal Physics, Ural Branch
Issue: Vol 61, No 2 (2016)
Pages: 306-309
Section: Short Communications
URL: https://ogarev-online.ru/1063-7842/article/view/196890
DOI: https://doi.org/10.1134/S1063784216020146
ID: 196890

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Abstract

The structure and microhardness of textured ribbon substrates made of binary copper-based alloys and annealed in the temperature interval 400–600°C is investigated. The optimal temperature of additional annealing at which the strength of Cu–Fe and Cu–Cr alloys reaches a maximum is determined. From experimental data, recommendations on the optimal deposition temperature of epitaxial buffer layers and superconducting films can be developed.