Composition, Properties, Application, and Manufacturing Features of Binary Copper–Phosphorus Solders

Abstract

The field of application is given for binary copper–phosphorus alloys in the metallurgical industry. Features of copper–phosphorus alloy structure are described. Binary copper–phosphorus solders produced in Russia and abroad are analyzed. Processing properties are provided for binary copper–phosphorus solders in relation to phosphorus content. Features of soldering with binary copper–phosphorus solders are provided. Characteristics of copper–phosphorus solder manufacture by domestic producers in the form of ribbon, bar, and wire are given. It is shown that during hot extrusion of copper–phosphorus alloys they develop superplastic flow. A mechanism is described for increasing the ductility of some copper–phosphorus alloys after thorough hot extrusion.